BE Semiconductor Industries (OTCMKTS:BESIY) Short Interest Update

BE Semiconductor Industries (OTCMKTS:BESIY – Get Rating) was the recipient of a significant increase in short interest during the month of May. As of May 15th, there was short interest totalling 3,000 shares, an increase of 233.3% from the April 30th total of 900 shares. Based on an average daily trading volume, of 3,900 shares, the days-to-cover ratio is currently 0.8 days.

Shares of OTCMKTS BESIY opened at $60.03 on Friday. The company has a debt-to-equity ratio of 0.49, a quick ratio of 4.49 and a current ratio of 4.99. The company has a market cap of $4.35 billion, a P/E ratio of 13.80 and a beta of 1.48. The firm’s fifty day moving average is $69.61 and its two-hundred day moving average is $79.96. BE Semiconductor Industries has a 52-week low of $50.21 and a 52-week high of $98.23.

The business also recently declared a dividend, which was paid on Monday, May 9th. Shareholders of record on Wednesday, May 4th were issued a $3.1198 dividend. The ex-dividend date of this dividend was Tuesday, May 3rd. This represents a yield of 4.58%. BE Semiconductor Industries’s dividend payout ratio is currently 68.51%.

Several equities research analysts recently issued reports on the stock. UBS Group dropped their target price on shares of BE Semiconductor Industries from €97.00 ($103.19) to €88.00 ($93.62) and set a “buy” rating on the stock in a report on Friday, May 6th. Deutsche Bank Aktiengesellschaft dropped their price target on shares of BE Semiconductor Industries from €84.00 ($89.36) to €76.00 ($80.85) in a research note on Wednesday, May 4th.

BE Semiconductor Industries Company Profile (Get Rating)

BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries worldwide. The company's principal products include die attach equipment, such as single chip, multi chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra thin, and wafer level molding, as well as trim and form, and singulation systems.

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