Oxford Instruments plc (LON:OXIG) Declares Dividend of GBX 5.10

Oxford Instruments plc (LON:OXIG) declared a dividend on Tuesday, November 12th,Upcoming Dividends.Co.Uk reports. Investors of record on Thursday, November 28th will be given a dividend of GBX 5.10 ($0.06) per share on Friday, January 10th. This represents a yield of 0.24%. The ex-dividend date of this dividend is Thursday, November 28th. The official announcement can be seen at this link.

Oxford Instruments Stock Up 0.2 %

Shares of LON:OXIG opened at GBX 2,050 ($25.77) on Wednesday. The company has a current ratio of 1.64, a quick ratio of 1.11 and a debt-to-equity ratio of 12.96. The firm has a market cap of £1.19 billion, a price-to-earnings ratio of 2,406.98, a PEG ratio of -3.56 and a beta of 0.96. The stock’s 50-day moving average price is GBX 2,077.03 and its two-hundred day moving average price is GBX 2,291.71. Oxford Instruments has a 12-month low of GBX 1,870 ($23.51) and a 12-month high of GBX 2,765 ($34.76).

Analyst Ratings Changes

Several equities research analysts recently issued reports on the stock. Berenberg Bank decreased their target price on shares of Oxford Instruments from GBX 2,925 ($36.77) to GBX 2,830 ($35.58) and set a “buy” rating on the stock in a research report on Tuesday, November 12th. Shore Capital reiterated a “buy” rating on shares of Oxford Instruments in a report on Wednesday, October 16th.

About Oxford Instruments

Oxford Instruments plc provide scientific technology products and services for academic and commercial organizations worldwide. It operates through three segments: Materials & Characterisation, Research & Discovery, and Service & Healthcare. The company offers atomic force, electron, and Raman microscopy; deposition tools comprising plasma enhanced chemical vapour deposition, chemical vapour deposition, inductively coupled plasma chemical vapour deposition, atomic layer deposition, and ion beam deposition systems; and etch tools, including inductively coupled plasma etching, reactive ion etching, deep silicon etching, atomic layer etching, and ion beam etching systems.