ChipMOS TECHNOLOGIES (NASDAQ:IMOS) to Buyback $0.00 in Outstanding Stock

ChipMOS TECHNOLOGIES (NASDAQ:IMOSGet Free Report) declared that its board has authorized a share repurchase plan on Tuesday, January 21st, RTT News reports. The company plans to repurchase $0.00 in outstanding shares. This repurchase authorization permits the semiconductor company to repurchase shares of its stock through open market purchases. Stock repurchase plans are generally an indication that the company’s board of directors believes its stock is undervalued.

ChipMOS TECHNOLOGIES Stock Performance

NASDAQ IMOS traded up $0.48 on Tuesday, hitting $18.72. 46,588 shares of the company’s stock were exchanged, compared to its average volume of 23,107. The firm has a market cap of $680.66 million, a price-to-earnings ratio of 13.09 and a beta of 0.86. The firm’s 50-day moving average price is $19.05 and its two-hundred day moving average price is $21.75. ChipMOS TECHNOLOGIES has a fifty-two week low of $17.70 and a fifty-two week high of $32.19. The company has a debt-to-equity ratio of 0.49, a current ratio of 3.07 and a quick ratio of 2.72.

ChipMOS TECHNOLOGIES (NASDAQ:IMOSGet Free Report) last announced its quarterly earnings data on Tuesday, November 5th. The semiconductor company reported $0.26 earnings per share for the quarter. The firm had revenue of $191.70 million for the quarter. ChipMOS TECHNOLOGIES had a return on equity of 6.66% and a net margin of 7.25%.

Analyst Upgrades and Downgrades

Separately, StockNews.com cut shares of ChipMOS TECHNOLOGIES from a “buy” rating to a “hold” rating in a research note on Tuesday.

Check Out Our Latest Report on ChipMOS TECHNOLOGIES

About ChipMOS TECHNOLOGIES

(Get Free Report)

ChipMOS TECHNOLOGIES INC. engages in the research, development, manufacture, and sale of high-integration and high-precision integrated circuits, and related assembly and testing services in the People’s Republic of China, Taiwan, Japan, Singapore, and internationally. It operates through Testing; Assembly; Testing and Assembly for LCD, OLED and Other Display Panel Driver Semiconductors; Bumping; and Others segments.

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